Simulation of Particle Incorporation during Electrodeposition Process

Abstract

Theprimary and secondary current distributions for the particle incorporation processduring electrocodeposition of a metal film were numerically studied. Thegrowth of an electrodeposited film along the electrode is governedby the local current density that is affected by thepresence of a nonconducting particle. It was assumed that theeffect of lateral displacement of the fluid between a particleand an electrode is negligible. The level set method wasused to track the moving interface as it grows aroundthe particle, and the Laplace equation for the electrical potentialwas solved by a finite-element method. For a primary currentdistribution, voids beneath the particle are generated due to thecharacteristics of the potential distribution, so that the metallic filmdoes not grow along the particle surface. The resistance incrementdue to the presence of the particle was compared forthe cases of stationary and growing metallic films. A smallvoid on top of the particle when incorporated by metalis observed with a secondary current distribution.\r\r \r ©2005 The Electrochemical Society