The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

Abstract

Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost.