CHARACTERIZATION OF THE VERY LOW CONTACT RESISTANCE ON HEAVILY BORON DOPED (113) CVD DIAMOND

Abstract

The low resistance of ohmic contacts on diamond layers is important for the fabrication of diamond power electronic devices with fast switching capabilities for future high voltage applications. The low barrier height between the metal and diamond, high level of boron doping and annealing at elevated temperatures are the most critical parameters to reach the lowest contact resistivity. In this work, we report on titanium/gold ohmic contacts prepared on the heavily boron-doped (113) epitaxial diamond layers. The contact resistance has been characterized by the Circular Transmission Line Model (cTLM) structures. We used the analytical model of field enhanced emission, tunneling and the image force influence including Fermi level position dependence on the boron concentration for theoretical Ti/Au contact analysis and the Silvaco TCAD 2D simulation to estimate the measurement error associated with the nonzero metal resistance. We show that the resulting simulation values are consistent with the experimental results.