Laser Texturing of Tungsten Carbide (WC-Co): Effects on Adhesion and Stress Relief in CVD Diamond Films

Abstract

This study proposes a laser texturing method to optimize adhesion and minimize residual stresses in CVD diamond films deposited on tungsten carbide (WC-Co). WC-5.8 wt% Co substrates were textured with quadrangular pyramidal patterns (35 µm) using a 1064 nm nanosecond-pulsed laser, followed by chemical treatment (Murakami’s solution + aqua regia) to remove surface cobalt. Diamond films were grown via HFCVD and characterized by Raman spectroscopy, EDS, and Rockwell indentation. The results demonstrate that pyramidal texturing increased the surface area by a factor of 58, promoting effective mechanical interlocking and reducing compressive stresses to −1.4 GPa. Indentation tests revealed suppression of interfacial cracks, with propagation paths deflected toward textured regions. The pyramidal geometry exhibited superior cutting post-deposition cooling time for stress relief from 3 to 1 h. These findings highlight the potential of laser texturing for high-performance machining tool applications.