Integration of single carbon nanofibers in standard via interconnects

Abstract

We present an innovative integration process to obtain via interconnects made of one single carbon nanofiber structurally close to multiwall nanotubes. The nanofiber's growth is obtained thanks to a self-aligned Co based layer which plays the role of catalyst and diffusion barrier at the same time. scanning spreading resistance microscopy has been used to determine locally the electrical properties of such interconnects. We have measured resistances down to 10 k for 40 nm wide integrated wires. © 2008 American Institute of Physics.