Evaluation of Reliability of a Joint Using Anisotropic Conductive Adhesive

Abstract

Anisotropic conductive adhesive film (ACF) is an interconnection material in electronic packages such as connecting a LCD panel on a circuit substrate. It is expected to be a key technology for the chip size packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of the electrical performance and the mechanical reliability. This study presents an evaluation technology for the delamination at connections using ACF. We utilized the stress intensity factors of an interface crack between jointed dissimilar materials to evaluate the delamination strength of a connection. As the result, the residual stress of an interface between a chip and ACF is higher than that between ACF and substrate. And also we investigated the mode dependence of mechanical test, and found out that an interface crack between ACF and substrate was more affected by mode II rather than mode I at high temperature. © 2003, The Japan Institute of Electronics Packaging. All rights reserved.