Abstract
In 2007 the semiconductor manufacturing industry is expected to make more than $250 billion gross revenue and invest over $40 billion in new equipment. The demand for cheaper and increasingly powerful end products, like PCs, Laptops and MP3 Players is the driving force for further development of production equipment. Barrier breaking picosecond lasers for direct ablation of semiconductors are paving the way for the next generation of such machinery.
Cite
CITATION STYLE
APA
Weiler, S. (2008). Laser Micro Processing of Semiconductors and Dielectrics. Laser Technik Journal, 5(1), 40–42. https://doi.org/10.1002/latj.200790205
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