Abstract
Hard x-ray photoelectron spectroscopy (HAXPES) was performed on In 0.53Ga 0.47As/Al 2O 3 gate stacks as deposited and annealed at 400°C, 500°C, and 700°C to test for out-diffusion of substrate elements. Ga and As core-level intensities increase with increasing anneal temperature, while the In intensity decreases. HAXPES was performed at two different beam energies to vary the surface sensitivity; results demonstrate Ga and As out-diffuse into the Al 2O 3 film. Analysis suggests the presence of an interlayer containing Ga and As oxides, which thickens with increasing anneal temperature. Further diffusion, especially of Ga, into the Al 2O 3 film is also observed with increasing anneal temperature. © 2012 U.S. Government.
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CITATION STYLE
Weiland, C., Lysaght, P., Price, J., Huang, J., & Woicik, J. C. (2012). Hard x-ray photoelectron spectroscopy study of As and Ga out-diffusion in In 0.53Ga 0.47As/Al 2O 3 film systems. Applied Physics Letters, 101(6). https://doi.org/10.1063/1.4745207
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