Research on Printing Defects Inspection of Solder Paste Images

Abstract

Solder paste printing is the first part of the surface mount process flow; its postprinting defect inspection is particularly important. In this paper, we focus on studying the printing defects inspection algorithm for solder paste on PCB (Printed Circuit Board) images. The work proposes a number of methods to enhance the defects inspection performance of solder paste printing: A regional multidirectional data fusion image interpolation method, which can achieve fast and high precision image interpolation; a method for detecting solder paste areas with better accuracy, efficiency, and robustness; an improved connected domain labeling method to reduce time complexity; and defects detection and types classification method, which extracts features and centroid of every solder paste region and completes the inspection by comparing with a standard image. The experiments show that the defects inspection algorithm can detect the most common types of defects with low time consumption, high inspection accuracy, and classification accuracy.