Research on image monitoring method of electron beam selection melting

Abstract

In order to overcome the problem that the lack of real-time detection technology and the existing detection methods cannot select the process area flexibly in the process of electron beam selective melting, this paper presents a digital electronic imaging method which can monitor the roughness and tiny flaws on the surface of components layer by layer. The digital electronic images were produced by detecting both secondary electrons (SE) and backscattered electrons (BSE) originating from interactions between the electron beam and the metal powder. The imaging principle and the hardware circuit of the system are introduced in detail. Finally, the effectiveness of this design is verified by the experiments.