Chip on Board: Technologies for Multichip Modules

Abstract

Preface Acknowledgments A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications Making COB testing tractable: chip pretest and system diagnostics Chip level interconnect wire bonding for multichip modules Chip level interconnect: wafer bumping and inner lead bonding Chip level interconnect: solder bumped flip chip Chip attachment Wire bonding chip on board Tape automated bonding chip on board and on MCM-D Solder bumped flip chip attach on SLC board and multichip module Micron bump bonding chip on board chip on board encapsulation Underfill encapsulation for flip chip applications Index