Modelling and simulation of adhesive curing processes in bonded piezo metal composites

Abstract

This work deals with the modelling and simulation of curing phenomena in adhesively bonded piezo metal composites (PMC) which consist of an adhesive layer, an integrated piezoelectric module and two surrounding metal sheet layers. In a first step, a finite strain modelling framework for the representation of polymer curing phenomena is proposed. Based on this formulation, a concretised model is deduced and applied to one specific epoxy based adhesive. Here, appropriate material functions are provided and the thermodynamic consistency is proved. Regarding the finite element implementation, a numerical scheme for time integration and a new approach for maintaining a constant initial volume at arbitrary initial conditions are provided. Finally, finite element simulations of a newly proposed manufacturing process for the production of bonded PMC structures are conducted. Thereby, a representative deep drawing process is analysed with respect to the impact of the adhesive layer on the embedded piezoelectric module. © 2014 Springer-Verlag Berlin Heidelberg.