Revisiting the Constrained Blister Test to Measure Thin Film Adhesion

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Abstract

A thin film is clamped at the periphery to form a circular freestanding diaphragm before a uniform pressure, p, is applied to inflate it into a blister. The bulging membrane adheres to a rigid constraining plate with height, w0, from the nondeformed membrane. Increasing pressure expands the contact circle of radius, c. Depressurization causes shrinkage of the contact and "pull-off" or spontaneous detachment from the plate. Simultaneous measurement of (p, w0, c) allows one to determine the adhesion energy, γ. A solid mechanics model is constructed based on small strain and linear elasticity, which shows a characteristic loading-unloading hysteresis. The results are consistent with a large deformation model in the literature.

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Zhu, T., Li, G., Müftü, S., & Wan, K. T. (2017). Revisiting the Constrained Blister Test to Measure Thin Film Adhesion. Journal of Applied Mechanics, Transactions ASME, 84(7). https://doi.org/10.1115/1.4036776

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