Kinetics of dissolution of copper in liquid tin with ultrasonic waves

Abstract

Ultrasonic-assisted soldering, as a type of new welding method, is widely used in the field of electronic packaging. This research used the immersion method to study the dissolution behavior of copper in liquid tin and the growth of IMC at 513, 543, and 573 K with/without ultrasonic waves. The amount of copper dissolved and IMC layer thickness were measured and the dissolution activation energy of Cu/Sn was calculated. Experimental results indicated that Without ultrasonic waves, the amount of copper dissolved increased nonlinearly with immersion time. However, with ultrasonic waves, the amount of copper dissolved increased linearly with immersion time. The amount of copper dissolved in liquid tin increased considerably with ultrasonic waves, and the dissolution rate increased by 7–8 times. The thickness of the IMC layer decreased as the ultrasonic time and ultrasonic power increased. Meanwhile, the ultrasonic waves reduced the dissolution activation energy of the Sn/Cu system.