Femtosecond versus nanosecond laser micro-machining of InP: A nondestructive three-dimensional analysis of strain

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Abstract

Ultra-fast femtosecond laser micro-machining can lead to improved surface morphology and a reduction in the heat-affected zone. In this paper, synchrotron x-ray topography (SXRT) and micro-Raman spectroscopy have been used as nondestructive tools to compare the residual strain in InP substrates after femtosecond (fs) and nanosecond (ns) laser processing. Two-dimensional stain distributions with varying probing depth and cross-section images across the four laser machined grooves were obtained. The recrystallized poly-InP layer on the laser machined groove surface has been found to be highly strained in tension, and the stress magnitude is much bigger than the shear stress introduced by crystal distortion underneath. After comparing the simulation results of SXRT orientation contrast with the topography images, the nature of the crystal plane distortion induced by both fs and ns laser machining methods was elucidated. © 2007 IOP Publishing Ltd.

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APA

Xu, L., Lowney, D., McNally, P. J., Borowiec, A., Lankinen, A., Tuomi, T. O., & Danilewsky, A. N. (2007). Femtosecond versus nanosecond laser micro-machining of InP: A nondestructive three-dimensional analysis of strain. Semiconductor Science and Technology, 22(8), 970–979. https://doi.org/10.1088/0268-1242/22/8/024

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