The Relative Contributions of Complexation, Dispersing, and Adsorption of Tannic Acid to the Dissolution of Copper Oxide Nanoparticles

Abstract

Copper oxide nanoparticles (CuO NPs) are one of the most widely used materials owing to their excellent properties such as thermal and photochemical stability, superconductivity, and high electrochemical activity. Once they enter the environment, Cu2+ may be released in water, which alters the behavior and toxicity of CuO NPs. The present study thus investigated the dissolution of CuO NPs (40 nm) in the presence of tannic acid (TA), a model chemical of dissolved organic matter. The adsorption of TA decreased the hydrodynamic diameter of CuO NPs and increased the zeta potential of the suspension. Although the adsorption of TA on particle surface improved the dispersion of CuO NPs, their dissolution extents were all reduced at TA concentration up to 55.4 mg C L−1. At pH 5, the contributions of TA complexed Cu to the overall dissolution increased up to 37.8% as a function of TA concentrations. All the findings shown above approved that the strong adsorption of TA played a dominant role in preventing the dissolution of CuO NPs. Graphical abstract: [Figure not available: see fulltext.].