Abstract
We herein review the technology transition from thescaling-driven technical roadmap to the power-driven post-Moore roadmap,focusing on the primary trend in micro/nanoelectronics devices. Thenovel devices and process integration technologies in post-Moore era, suchas the FinFET, gate-all-around transistor, tunneling FET, and the sequential 3Dintegration process were systematically analyzed to provide newinsights into the everlasting evolution of VLSI technology.
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CITATION STYLE
LI, M., & HUANG, R. (2018). Device and integration technologies for VLSI in post-Moore era. SCIENTIA SINICA Informationis, 48(8), 963–977. https://doi.org/10.1360/n112018-00114
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