Device and integration technologies for VLSI in post-Moore era

  • LI M
  • HUANG R
N/ACitations
Citations of this article
8Readers
Mendeley users who have this article in their library.

Abstract

We herein review the technology transition from thescaling-driven technical roadmap to the power-driven post-Moore roadmap,focusing on the primary trend in micro/nanoelectronics devices. Thenovel devices and process integration technologies in post-Moore era, suchas the FinFET, gate-all-around transistor, tunneling FET, and the sequential 3Dintegration process were systematically analyzed to provide newinsights into the everlasting evolution of VLSI technology.

Cite

CITATION STYLE

APA

LI, M., & HUANG, R. (2018). Device and integration technologies for VLSI in post-Moore era. SCIENTIA SINICA Informationis, 48(8), 963–977. https://doi.org/10.1360/n112018-00114

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free