Demonstrated is a nonvolatile memory device based on a SiO 2/GaN/AlGaN/GaN heterostructure in which the upper GaN layer acted as a storage node. Charges were stored in and released from the upper GaN layer by applying positive and negative gate biases, respectively. The top SiO 2 layer acted as a blocking layer. The threshold voltage shift was ∼ 3 V between the program and erase modes and the retention characteristics were very stable over 10000 s. © The Institution of Engineering and Technology 2013.
CITATION STYLE
Lee, J. G., Choi, S., Park, B. R., Seo, K. S., Kim, H., & Cha, H. Y. (2013). Nonvolatile memory device based on SiO2/GaN/AlGaN/GaN heterostructure. Electronics Letters, 49(8), 529–531. https://doi.org/10.1049/el.2012.4083
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