Cobalt-Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling

Abstract

In the rapidly advancing semiconductor sector, thermal management of chips remains a pivotal concern. Inherent heat generation during their operation can lead to a range of issues such as potential thermal runaway, diminished lifespan, and current leakage. To mitigate these challenges, the study introduces a superhygroscopic hydrogel embedded with metal ions. Capitalizing on intrinsic coordination chemistry, the metallic ions in the hydrogel form robust coordination structures with non-metallic nitrogen and oxygen through empty electron orbitals and lone electron pairs. This unique structure serves as an active site for water adsorption, beginning with a primary layer of chemisorbed water molecules and subsequently facilitating multi-layer physisorption via Van der Waals forces. Remarkably, the cobalt-integrated hydrogel demonstrates the capability to harvest over 1 and 5 g g−1 atmospheric water at 60% RH and 95% RH, respectively. Furthermore, the hydrogel efficiently releases the entirety of its absorbed water at a modest 40°C, enabling its recyclability. Owing to its significant water absorption capacity and minimal dehydration temperature, the hydrogel can reduce chip temperatures by 5°C during the dehydration process, offering a sustainable solution to thermal management in electronics.