New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. New Advanced Cu Deposition Process with Long Throw Sputtering.

TAKAKUWA, K. (1998). New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. New Advanced Cu Deposition Process with Long Throw Sputtering. Journal of the Surface Finishing Society of Japan, 49(11), 1185–1191. https://doi.org/10.4139/sfj.49.1185