The implementation of software and hardware for dynamic thermal management of electronic devices

Abstract

As the integration of electronic devices increases, thermal issues have become a key obstacle to performance improvement of them. Combining the hardware and software methods could be a reasonable way to the efficient and robust dynamic thermal management. But the algorithm design and heat dissipation enhancement remains an enormous challenge in these fields. This paper systematically introduces the efforts that our team have put in thermal aware, passive thermal regulation and cooling sysytem energy saving. Specifically, online temperature field reconstruction algorithm, based on matrix decomposition and sampling theory, is designed. Composite phase change materials with high thermal conductivity (~35 W (m K)-1) is developed. Furthermore, a novel phase change cooling strategy, by utilizing desorption process of water inside sorbents, with high enthalpy (equivalent to 1950 J/g) is proposed. Then the energy-saving cooling system of data center based on adsorption refrigeration is studied. These technologies focus on the core concerns of dynamic thermal management of electronic devices, and provide solutions from different scales. Finally, we discuss the remaining challenges and give an outlook on the future.