Compact shorted stacked-patch antenna integrated with chip-package based on LTCC technology

Abstract

A low profile chip-package stacked-patch antenna is proposed by using low temperature cofired ceramic (LTCC) technology. The proposed antenna employs a stacked-patch to achieve two operating frequency bands and enhance the bandwidth. The height of the antenna is decreased to 4.09 mm (about /25 at 2.45 GHz) due to the shorted pin. The package is mounted on a 44 × 44 mm2 ground plane to miniaturize the volume of the system. The design parameters of the antenna and the effect of the antenna on chip-package cavity are carefully analyzed. The designed antenna operates at a center frequency of 2.45 GHz and its impedance bandwidth (S 11 < - 10 d B) is 200 MHz, resulting from two neighboring resonant frequencies at 2.41 and 2.51 GHz, respectively. The average gain across the frequency band is about 5.28 dBi.