Reliability study of polymer adhesive bump interconnections

Abstract

In this paper, results of investigations concerning the reliability of adhesive bumps are presented. These bumps interconnect test flip chips with different sizes to both Al2O3 and FR4 substrates. The samples have been exposed to thermal cycling. The transition resistance of the bumps (TRR), as a criterion of the interconnection's quality, has been measured at different time instances of the environmental stress. This study shows that there is no reliable adhesive bump interconnection without the use of underfill material.