Experimental investigation on the critical heat flux of Cu-water, Al-water nanofluids for precise cooling of electronic systems

Abstract

In recent year's huge development has taken place in the fields of integrated circuits technology and high speed processors. The performance of such electronic system is highly affected by heat generated during the operation. These heat generated on the electronic systems has to be dissipated in order to increase the performance and to avoid the damage due to high temperature resulting from heat generation. The increase in temperature may be reduced by the use of effective heat transfer devices such as heat pipes. The maximum heat transfer limits of the heat pipes are restricted by their heat flux limit. Critical heat flux (CHF) defines the maximum heat transfer limit. To meet the high demand of coolingin electronic industries, enhancement in critical heat flux limit of heat pipes as well as heat transfer surfaces are essential. Therefore in order to identify the ways to enhance the critical heat flux limit, series of experiment were conducted using two different types of nanofluids such as Cu-water and Al-water suspensions. For each nanofluids four different concentration were tested (0.0005wt%, 0.001wt%, 0.005wt%, 0.01wt %). There are two different type of wires were used to study the CHF. Ni-Cr wire with diameter of 0.19mm and 0.119mm, SS wire with the diameter of 0.08mm were used. The critical heat flux of Al-water and Cu-water Nanofluids is improved up to 124 % and 164 % respectively when compared with DI water.