Synthesis and characterization of novel trifunctional fluorine containing epoxy resins based on 1,1,1-tris(2,3-epoxypropoxyphenyl)-2,2,2-trifluoroethane

Abstract

A novel trifunctional fluorine containing epoxy compound, 1,1,1-Tris(2,3-epoxypropoxyphenyl)-2,2,2-trifluoroethane (TEF) synthesized starting from 4-bromoanisole was cured with alicyclic anhydride or aromatic diamines to produce the epoxy resins. As comparison, commercial available Biphenol A 828 epoxy (BPA) was cured under the same conditions. Experimental results indicated that the cured TEF epoxy resins showed good thermal stability with onset thermal decomposition temperature (Td) of 363-388 °C in nitrogen, glass transition temperature (Tg) of 210-287 °C (determined by DMA) and coefficient of thermal expansion (CTE) ranged in 46.7-59.6 ppm/°C. The fluorine containing epoxy resins possessed outstanding mechanical properties with flexural strengths of 64-115 MPa, flexural moduli of 2.29-2.65 GPa. The epoxy resins also exhibited excellent electric insulating properties with volume resistivity of 1.19-8.15 × 1016 Ω·cm and the dielectric constants at 1 MHz of 3.2-3.5 as well as low moisture absorption of 0.31-0.87%. As comparison with BPA resins, the trifunctional fluorine containing TEF resins exhibit higher Tg and improved dielectric properties as well as low CTE, which are promising candidates for advanced microelectronic packaging. © 2007 The Society of Polymer Science.