Ion-assisted Si/XeF2 etching: Temperature dependence in the range 100–1000 K

Abstract

The Ar+-ion enhanced Si(100)/XeF2 reaction is studied in a multiple beam setup for silicon temperatures from 100 K up to 1000 K. The XeF2 flux is 2.7 monolayers/s and the Ar+ flux 0.033 monolayers/s at an energy of 1000 eV. Both the XeF2 consumption and the SiFx production are measured by mass spectrometry. The enhancement of the etch rate peaks around 250 K as is observed in both the XeF2 and SiFx signals. The gradual decline above 250 K is attributed to a diminished surface fluorination and XeF2 precursor concentration. The dropoff below 250 K is presumably caused by sputtering of the XeF2 precursor, as is concluded from the temperature dependence of the XeF+/XeF2+ signal ratio. Around 175 K this decrease is so strong that the ions seem to no longer enhance, but rather reduce, the etch rate. Below 150 K the ions are driving the etch process. In this range the spontaneous process is blocked by XeF2 condensation, but the ion-assisted process continues due to sputtering or dissociation of the condensate.