Copper Protection by a Self-Assembled Monolayer of Alkanethiol

  • Metikoš-Huković M
  • Babić R
  • Petrović Ž
  • et al.
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Abstract

A self-assembled monolayer of 1-dodecanethiol (DT) was formed on a copper surface pretreated using different methods. The corrosion protection abilities of the monolayer were evaluated in an air-saturated 0.51 M NaCl solution using various techniques including electrochemical impedance spectroscopy, polarization, coulometry, weight loss, and x-ray photoelectron spectroscopy. It was found that the corrosion resistance of the monolayer was improved markedly by using a nitric acid etching method. A minimum concentration of 10 -4 M DT was needed to form a protective monolayer. The DT-monolayer retarded the reduction of dissolved oxygen and inhibited the growth of copper oxide in the NaCl solution. In comparison with other inhibitors, such as benzotriazole (BTA) and mercapto-benzothiazole (MBT), the DT-monolayer showed much better corrosion resistance in aqueous solution.

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Metikoš-Huković, M., Babić, R., Petrović, Ž., & Posavec, D. (2007). Copper Protection by a Self-Assembled Monolayer of Alkanethiol. Journal of The Electrochemical Society, 154(2), C138. https://doi.org/10.1149/1.2404781

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