Toward atom probe tomography of microelectronic devices

Abstract

Atom probe tomography and scanning transmission electron microscopy has been used to analyze a commercial microelectronics device prepared by depackaging and focused ion beam milling. Chemical and morphological data are presented from the source, drain and channel regions, and part of the gate oxide region of an Intel® i5-650 p-FET device demonstrating feasibility in using these techniques to investigate commercial chips.