Abstract
The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.
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CITATION STYLE
Mulcahy, J., Peters, F. H., & Dai, X. (2022, January 1). Modulators in Silicon Photonics—Heterogenous Integration & and Beyond. Photonics. MDPI. https://doi.org/10.3390/photonics9010040
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