Nonlinear multiphoton modification of glass substrates for fabrication of high aspect ratio through-glass vias

5Citations
Citations of this article
7Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

To meet the demands of high-frequency wireless communications and Internet of Things (IoT) applications, modern integrated circuit (IC) packages should support operating frequencies in the GHz range and be implemented on fine substrate structures. Glass has many advantages as an interposer material for three-dimensional IC (3D-IC) designs, including tunable electrical and mechanical properties, amenability to large-scale processing, and high optical transparency in the visible range. Moreover, glass is easily processed to produce the through-glass vias (TGVs) required to realize high-frequency circuit designs and microelectromechanical systems devices. The present study proposes a method for patterning TGVs on glass substrates via a nonlinear multiphoton-assisted modification process performed using single-pulse irradiation by a 1030-nm picosecond laser. A theoretical model is additionally proposed to describe the glass substrate modification mechanism induced by the nonlinear multiphoton excitation effect. The feasibility of the proposed method is demonstrated by patterning a TGV array with a high aspect ratio of 1:10 and a taper angle of ∼2° on a Corning SGW3 glass substrate.

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Cite

CITATION STYLE

APA

Lee, M. K., Yu, J. Z., Chang, H. Y., Chang, C. Y., Liu, C. S., & Lin, P. C. (2022). Nonlinear multiphoton modification of glass substrates for fabrication of high aspect ratio through-glass vias. AIP Advances, 12(5). https://doi.org/10.1063/5.0086879

Readers' Seniority

Tooltip

PhD / Post grad / Masters / Doc 2

67%

Lecturer / Post doc 1

33%

Readers' Discipline

Tooltip

Engineering 2

50%

Physics and Astronomy 1

25%

Materials Science 1

25%

Save time finding and organizing research with Mendeley

Sign up for free