Abstract
The effect of ion implantation on the behavior and extent of layer inversion in Ni-silicided poly-Si was investigated. Two different implantation species, namely, BF 2 + and N 2 + , which affect the poly-Si grain growth were used. Retarded layer inversion was found with the ion-implanted poly-Si substrates. However, the formation of NiSi 2 takes place at 700°C, which is slightly lower than that on Si(100). The easy nucleation of NiSi 2 on poly-Si is implicitly related to the morphology perturbation.
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CITATION STYLE
Lee, P. S., Pey, K. L., Mangelinck, D., Ding, J., Chi, D. Z., Osipowicz, T., … Chan, L. (2002). Effect of Ion Implantation on Layer Inversion of Ni Silicided Poly-Si. Journal of The Electrochemical Society, 149(9), G505. https://doi.org/10.1149/1.1494828
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