Composites of styrene-butadiene block-copolymer reinforced with waste printed circuit boards (WPCB)

Abstract

In recent years, the rapid development of electronic equipment led to millions of tons of waste printed circuit boards (WPCB) generated in the entire world rising important concerns regarding its recycling. Besides the metals recovery, intensively studied, the reuse of the nonmetals is especially difficult. In this study, the non-metallic fraction from the waste of printed circuit boards is used as reinforcing filler of a styrene-butadiene block-copolymer. The composites were characterized by mechanical and dynamo-mechanical analysis and thermo-gravimetry. The study aimed the reintroduction into the economic circuit of WPCB as composites suitable for the production of shoe soles injected directly on the footwear faces and as bitumen modifiers for road coverings.