Thermal Hysteresis of MEMS Packaged Capacitive Pressure Sensor (CPS) Based 3C-SiC

Abstract

Presented herein are the effects of thermal hysteresis analyses of the MEMS packaged capacitive pressure sensor (CPS). The MEMS CPS was employed on Si-on-3C-SiC wafer that was performed using the hot wall low-pressure chemical vapour deposition (LPCVD) reactors at the Queensland Micro and Nanotechnology Center (QMNC), Griffith University and fabricated using the bulk-micromachining process. The MEMS CPS was operated at an extreme temperature up to 500°C and high external pressure at 5.0 MPa. The thermal hysteresis phenomenon that causes the deflection, strain and stress on the 3C-SiC diaphragm spontaneously influence the MEMS CPS performances. The differences of temperature, hysteresis, and repeatability test were presented to demonstrate the functionality of the MEMS packaged CPS. As expected, the output hysteresis has a low hysteresis (less than 0.05%) which has the hardness greater than the traditional silicon. By utilizing this low hysteresis, it was revealed that the MEMS packaged CPS has high repeatability and stability of the sensor.