Evaluation of Methods of Soldering AlSi and AlSi-SiC Particle Composite Al Foams

Abstract

The cellular structure and unique properties of aluminum foams are the reason of their numerous applications and interests in respect of their joining. The paper includes the characterization of the essence of properties and application of aluminum and aluminum composite foams, the limitations, and possibilities of their soldering. The aim of the research is the consideration of methods of soldering AlSi foams and AlSi-SiC composite foams, and the joint structure. EDS and XRD investigations of the AlSi-SiC composite foams’ joints were done. The possibility of soldering AlSi9 foams and AlSi9-SiC composite foams using S-Bond 220 solder was confirmed, and higher tensile strength of the joint than the parent material was also ascertained