Crack-free high-aspect ratio holes in glasses by top-down percussion drilling with infrared femtosecond laser GHz-bursts

Abstract

Highlights The femtosecond laser GHz-burst technology provided crack-free holes with high aspect ratios using a laser operating in the infrared wavelength range. The influence of laser parameters on the depth and quality of the hole was revealed. We propose a propagation mechanism of the laser beam inside the hole during drilling. The drilled holes in two dielectrics, sodalime and fused silica, were compared.