Shear deformation of pure-Cu and Cu/Nb nano-laminates using micromechanical testing

Abstract

Solid phase processing by introducing shear deformation into materials can result in unique microstructure evolution and enhanced mechanical properties, especially for immiscible systems such as Cu/Nb. To better understand the correlation between microstructure and deformation behavior during shear, a dedicated testing design of stress localization at predicted sites is necessary. In this study, a specialized S-shaped specimen geometry is implemented to apply localized simple-shear loading in pure-Cu and Cu/Nb accumulative roll-bonded nanolaminates. The nanoscale microstructure and proximity of interfaces in Cu/Nb offer a ∼2.8-fold increase in shear stresses than pure-Cu. In pure-Cu, the plastic instability causes shear banding and an in-plane lattice rotation. In Cu/Nb, a partial bending of the interfaces occurred, resulting in a localized lattice rotation. The adapted geometry for micro-scale specimens thus successfully captures the shear deformation at predicted sites in two distinct material systems and could potentially be a powerful technique to study the deformation mechanisms.