Abstract
An outstanding approach for the development of a supramolecular metallogel with nickel(ii) ion and 5-aminoisophthalic acid as a gelator (LMWG) in DMF medium has been accomplished at room temperature. Rheological studies of the supramolecular Ni(ii)-metallogel established the mechanical compactness of the gel material. FESEM microstructural study and EDX elemental mapping showed flake-like morphological patterns and major chemical constituents of the Ni(ii)-metallogel. The possible metallogel formation approach has been examined using FT-IR spectroscopic study. Moreover, the supramolecular Ni(ii)-metallogel assemblies show electrical conductivity in metal-semiconductor (MS) junction electronic devices. The metallogel based thin film device shows an electrical conductivity of 1.53 × 10−5 S m−1. Semiconductor properties such as Schottky barrier diode nature of the synthesized Ni(ii)-metallogel based devices were explored.
Cite
CITATION STYLE
Pal, B., Dhibar, S., Mukherjee, R., Bhattacharjee, S., Ray, P. P., & Saha, B. (2023). A semiconducting supramolecular novel Ni(ii)-metallogel derived from 5-aminoisophthalic acid low molecular weight gelator: an efficient Schottky barrier diode application. Materials Advances, 4(16), 3628–3635. https://doi.org/10.1039/d3ma00260h
Register to see more suggestions
Mendeley helps you to discover research relevant for your work.