A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Abstract

In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.