Atomic Layer Deposition for Polypropylene Film Engineering—A Review

Abstract

Front Cover : In article number 2000127, Guanghui Song and Daniel Q. Tan summarize the recent advances in atomic layer deposition (ALD) techniques to engineer polypropylene (PP) film surfaces. ALD is a self‐limiting reaction process between gas and solid phases that allows precise control of atomby‐atom growth of the coating layer on a dense PP surface or within the pores of a membrane. Ultrathin layers of inorganic coating promise effective enhancement in the functionality, absorption, activation, mechanical and dielectric properties of PP films for the benefit of energy storage, film capacitors, catalytic membranes, and filtration/separation applications.