High-Throughput Low Power Area Efficient 17-bit 2's Complement Multilayer Perceptron Components and Architecture for on-Chip Machine Learning in Implantable Devices

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Abstract

In this manuscript the authors, design new hardware efficient combinational building blocks for a Multi Layer Perceptron (MLP) unit which eliminates the need for hardware generic Digital Signal Processing (DSP) units and also eliminates the need for on-chip block RAMs (BRAMs). The components were designed to minimise power and area consumption without sacrificing throughput. All designs were validated in a Field Programmable Gate Array (FPGA) and compared against unrestricted CPU-MATLAB implementations. Furthermore, a (2,2,2,2) MLP with back propagation was implemented and tested in a FPGA showing a total hardware utilisation of just 3782 LUTs, and no DSP or BRAMs. The MLP was also built in a Application Specific Integrated Circuit (ASIC) using a 130 nm technology by Skywater 130A. The results show that the area occupation was just 0.12~mm^{2} and consumed just 100 mW at 100 MHz input stimulus.

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APA

James Romaine, B., & Martin, M. P. (2022). High-Throughput Low Power Area Efficient 17-bit 2’s Complement Multilayer Perceptron Components and Architecture for on-Chip Machine Learning in Implantable Devices. IEEE Access, 10, 92516–92531. https://doi.org/10.1109/ACCESS.2022.3203179

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