Abstract
A novel time-resolved micro-Raman thermography technique has been developed to measure the active region temperature in AlGaN/GaN electronic devices, achieving a temporal and spatial resolution of 200 ns and 0.5-0.7 μm, respectively. AlGaN/GaN heterostructure field effect transistors (HFETs) grown on SiC and sapphire substrates are compared. Rapid temperature changes within 200 ns of current changes are followed by a slower change in device temperature. For a device on a SiC substrate an approximate temperature plateau is reached within 1 -2 μs after switching the device on or off, illustrating its fast thermal response. This is in contrast to the slower time constant of devices on sapphire substrates where μs-separated electrical pulses do not allow the devices to cool to room temperature between the electrical pulses. © 2007 WILEY-VCH Verlag GmbH & Co. KGaA.
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CITATION STYLE
Kuball, M., Riedel, G. J., Pomeroy, J. W., Sarua, A., Uren, M. J., Martin, T., … Wallis, D. J. (2007). Time-resolved nanosecond sub-micron resolution thermal analysis of high-power AlGaN/GaN HFETs. In Physica Status Solidi (A) Applications and Materials Science (Vol. 204, pp. 2014–2018). https://doi.org/10.1002/pssa.200674717
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