Effects of thermomechanical processing on the recrystallization texture and grain size of Al-1%Si sputtering target material

Abstract

An Al-1%Si alloy was solution treated and deformed by conventional cold rolling to different strains, followed by annealing at various temperatures until complete recrystallization. The microstructures of annealed samples were characterized by electron backscatter diffraction. It is found that under optimal conditions of cold rolling and annealing, the microstructure desired for sputtering target materials with fine, uniformly sized and randomly textured grains can be obtained for the Al-1%Si alloy.