Advancing Structural Health Monitoring: Accurate PCB Design for IoT-Based Real-Time Damage Detection with Digital Twin Integration

0Citations
Citations of this article
11Readers
Mendeley users who have this article in their library.
Get full text

Abstract

This paper introduces a cost-effective customised Printed Circuit Board (PCB) designed to establish an accurate Internet of Things (IoT) platform integrated with established Digital Twin (DT) models for advanced structural monitoring. The study focuses on developing a low-cost, precise PCB to synchronise real-time data between physical structures and their DT counterparts. The methodology includes a robust communication architecture utilising MQTT protocols, facilitating reliable data transmission and efficient integration with MATLAB for processing. Validation tests demonstrate high accuracy in data capture, with less than 1% deviation from conventional systems across multiple structural damage scenarios. This research highlights the potential of cost-effective PCB solutions for enhancing SHM and developing more resilient, proactive infrastructure management strategies.

Cite

CITATION STYLE

APA

Adib, S., Ewart, G., Vinogradov, V., & Gosling, P. D. (2026). Advancing Structural Health Monitoring: Accurate PCB Design for IoT-Based Real-Time Damage Detection with Digital Twin Integration. Sensors, 26(5). https://doi.org/10.3390/s26051672

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free