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Precision top‐down delayering of microelectronics devices using broad‐beam argon ion milling

  • Nowakowski P
  • Olexa K
  • Ray M
  • et al.
Wiley, (2016), 650-651
DOI: 10.1002/9783527808465.emc2016.6589
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Abstract

… Delayering is a popular choice because it allows top‐down, whole chip characterization. However, delayering … ion milling using a top‐down delayering technique can help to expose a …

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APA

Nowakowski, P., Olexa, K., Ray, M., & Fischione, P. (2016). Precision top‐down delayering of microelectronics devices using broad‐beam argon ion milling. In European Microscopy Congress 2016: Proceedings (pp. 650–651). Wiley. https://doi.org/10.1002/9783527808465.emc2016.6589

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