Abstract
This paper presents a novel Y-junction in folded substrate-integrated waveguide technology. The structure is analyzed with finite-element method using Ansys HFSS, and the simulation results show that the reflection coefficients of the 120° branch ports for the folded substrate-integrated waveguide Y-junction can satisfy the constraints for optimum performance of diplexers. In comparison with an unfolded substrate-integrated waveguide Y-junction, the characteristics of the presented structure can meet the constraints in a wider frequency band, which means that the flexibility for the selection of the up and down channel bands is increased.
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CITATION STYLE
Zhao, C., Fumeaux, C., & Lim, C. C. (2016). Folded Y-junction in substrate-integrated waveguide technology. In AMS 2016 - 2016 2nd Australian Microwave Symposium, Conference Proceedings (pp. 19–20). Institute of Electrical and Electronics Engineers Inc. https://doi.org/10.1109/AUSMS.2016.7593473
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