Fabrication Techniques for Thin-Film Silicon Layer Transfer

Abstract

New, cost effective fabrication processes for bonding and thinning silicon wafers for improving device performance and creating 3-D structures were investigated. Wafer bonding and de-bonding are key fabrication steps for many applications such as 3-D devices. Double bond transfer and single bond processes to fabricate silicon thin films on permanent substrates were investigated. Polymer and direct bonding techniques were studied to create both permanent and temporary bonds. De-bonding methods utilizing wet chemistry and laser lift-off are discussed.