Solution-Processed Two-Dimensional Materials for Device Applications

Abstract

Two-dimensional (2D) materials with dangling-bond-free surfaces have attracted considerable attention in next-generation electronic applications due to their distinctive properties, such as high carrier mobility, short-channel immunity, and strong light-matter interactions. Recently, various methods have been developed for the preparation of 2D materials, including mechanical exfoliation, chemical vapor deposition, and chemical solution-based processes. Among these, solution processing provides a cost-effective and low-temperature approach for large-scale production. This review highlights recent advancements in solution-processed 2D materials, focusing on preparation methods and their applications in electronic and optoelectronic devices. Additionally, future perspectives are proposed to advance the breakthrough and commercialization of solution technologies for value-added chemical production.